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Electronic Component Testing Lab

Broadline Components > Electronic Component Testing Lab

Ensuring the Integrity of Your Components

Welcome to our state-of-the-art Electronic Component Testing Lab, where precision and reliability meet to guarantee the authenticity and performance of your electronic components. This lab adheres to the AS6081 Standards for electronic component testing.

As a trusted partner in the aerospace, automotive, and electronics industries, we offer an extensive range of testing services backed by cutting-edge technologies and experienced professionals. Whether you need microscopic analysis or X-ray inspection, our comprehensive suite of services ensures the highest level of quality assurance for your components.

Our Testing Lab Provides:


At our Electronic Component Testing Lab, we employ advanced microscopy capabilities to conduct meticulous visual inspections of electronic components at a microscopic level. This process allows us to delve into the smallest details, revealing vital information that might otherwise remain hidden to the naked eye. By leveraging high-powered microscopes and skilled technicians, we can identify surface irregularities, signs of tampering, and other subtle anomalies that may indicate counterfeit or substandard parts.

Our experts meticulously examine the external features of each component, including soldering, markings, and packaging. We pay close attention to minute details such as font variations, alignment discrepancies, and texture variations. This level of scrutiny enables us to distinguish between genuine components and potential counterfeits, ensuring that only authentic parts find their way into your products.

Through 3D imaging, we can identify irregularities, verify part dimensions, and detect potential manufacturing defects that may escape traditional visual inspections. This advanced imaging technology enhances our ability to ensure the quality and reliability of your components.


Ensuring the accuracy and legitimacy of electronic component markings is crucial to maintaining the integrity of your supply chain. Our electronic component marking analysis involves a comprehensive assessment of the markings on each component. By examining part numbers, date codes, and manufacturer logos, we verify their authenticity, origin, and compliance with industry standards.

Counterfeiters often attempt to manipulate or alter markings to deceive unsuspecting buyers. Through our sophisticated analysis techniques, we can detect even the most subtle discrepancies or irregularities in markings. By verifying the accuracy of markings, we help you steer clear of the risks associated with counterfeit components, protect your reputation, and ensure the reliability of your products.

X-Ray Analysis

Non-destructive X-ray analysis is a powerful tool in our testing arsenal, allowing us to inspect the internal structure of electronic components without causing any damage. Our high-resolution X-ray machines provide detailed insights into the composition and construction of the parts, revealing hidden defects, poor soldering, and inconsistencies in packaging.

By utilizing X-ray analysis, we can identify voids in solder joints, delamination, and potential counterfeit components encapsulated within seemingly genuine packages. This rigorous inspection process ensures that your components meet the highest quality standards and perform optimally in critical applications.


Decapsulation is a vital process for understanding the internal construction of integrated circuits and other packaged components. Our lab utilizes precise and controlled decapsulation techniques to safely remove the outer layers of a component’s packaging, exposing its internal die, wires, and bonding.

Through this detailed examination, we can confirm the legitimacy of the components and identify any signs of tampering, such as repackaging or modifications. Decapsulation provides a deeper understanding of the component’s structure, enabling us to ensure the authenticity and reliability of your electronic parts.

Heated Solvents

Our heated solvent testing method is specifically designed to assess the resilience of component markings against tampering or removal attempts. Counterfeiters may try to alter or erase markings on electronic components to make them appear genuine. To combat this threat, we subject the components to carefully controlled conditions, exposing them to heated solvents.

During this process, our experts closely monitor the component’s response to the solvents. Genuine markings should remain intact, while counterfeit or tampered markings may show signs of deterioration or smudging. This testing procedure provides an additional layer of security and helps you avoid using potentially compromised components.

XRF Analysis

X-ray Fluorescence (XRF) analysis is an invaluable non-destructive technique that helps determine the elemental composition of electronic components. By irradiating the component with X-rays, this method induces fluorescent X-ray emissions characteristic of specific elements.

XRF analysis allows us to identify discrepancies in the materials used to construct the components, providing valuable insights into their authenticity and quality. This powerful technique complements other testing methods, enabling us to strengthen the integrity of your supply chain and ensure that you receive components of the highest standard.

Solderability Testing

Broadline Components Test Labs: Comprehensive Solderability Testing with JEDEC Standards and “Dip & Look” Methodology

Broadline Components Test Labs stands at the forefront of solderability testing, combining cutting-edge technology with industry best practices. We proudly offer solderability testing in compliance with JEDEC standards, ensuring every component adheres to the most rigorous of quality measures. Beyond traditional testing, our labs are skilled in the “Dip & Look” methodology, providing an immediate and insightful visual assessment of the soldering process. This allows for real-time corrections and refinements, ensuring your components are of unmatched quality. Dive deeper into our process, and witness the precision with which we handle each semiconductor chip as it’s meticulously dipped into a solder pot.

Moisture Baking

Moisture sensitivity is a critical factor affecting the reliability of electronic components, especially those with moisture-absorbing properties. Our moisture baking services are designed to remove accumulated moisture from components, a crucial step in ensuring their performance throughout their lifecycle.

Moisture accumulation can lead to defects such as delamination, popcorning, and micro-cracking during soldering processes, compromising the long-term reliability of the components. By subjecting the components to carefully controlled temperature and humidity conditions, we eliminate moisture-related issues, safeguarding the quality and dependability of your products.

Broadline Components is a leading industry player that specializes in offering comprehensive baking and dry packing services in strict accordance with JEDEC standards. With an unwavering commitment to quality and precision, Broadline Components has established itself as a trusted partner for electronics manufacturers worldwide. In the fast-paced world of semiconductor and electronic component manufacturing, moisture sensitivity is a critical concern, and Broadline Components addresses this challenge with utmost expertise.

Broadline Components’ state-of-the-art facilities are equipped with cutting-edge technology to ensure the safe and controlled removal of moisture from sensitive components. Their baking processes adhere meticulously to JEDEC standards, guaranteeing the preservation of component integrity throughout the entire procedure. Moreover, their dry packing services are executed with precision, utilizing moisture barrier bags and desiccants to maintain the components’ dryness and extend their shelf life. Customers can rely on Broadline Components to not only meet but exceed industry requirements, ensuring that their electronic components are ready for use in any demanding application, all while upholding the highest quality and compliance standards in the industry.

Why Choose Our Electronic Component Testing Lab?

  • Industry Expertise: Our team of skilled engineers and technicians possesses extensive experience in the field of electronic component testing and analysis.
  • Advanced Technology: We invest in the latest equipment and technologies to deliver accurate and reliable test results.
  • Compliance: Our testing processes adhere to industry standards and regulatory requirements, ensuring your components meet the highest quality standards.
  • Custom Solutions: We understand that each project is unique. Hence, we tailor our testing services to suit your specific needs and requirements.
  • Quick Turnaround: We prioritize efficiency without compromising accuracy, offering timely delivery of test results to meet your project timelines.

Contact Broadline Components for Electronic Component Testing

At Broadline Components, we take pride in providing comprehensive testing services to help you verify the integrity and authenticity of your electronic components. From microscopy to X-ray analysis and 3D imaging, our cutting-edge technologies and skilled professionals ensure that your components meet the highest quality standards. Partner with us to secure your supply chain, safeguard your reputation, and deliver top-notch products to your customers.

Contact us today to learn more about our electronic component testing services and how we can assist you in ensuring the reliability of your components.